Filtronic PLC is a world leader in the design and manufacture of customised microwave and millimetre wave electronics. Our products are used within satellite, defence, terrestrial telecommunications and other related applications. Our investment in high calibre staff, leading edge technology and a world class manufacturing facility underpin our growth strategy and our aim to be a world class supplier of high frequency products and solutions.
As we scale our advanced packaging and assembly capability at NetPark, we are expanding our Process Engineering team to support the transition of new technologies from development into stable, high-yield production.
The Process Engineer is responsible for the evaluation, development, optimisation and control of advanced semiconductor and RF module assembly processes. The role focuses particularly on die attach technologies (silver epoxy, silver sinter, and eutectic attach) and gold wire/ribbon bonding across a range of substrate and device materials.
In addition, the Process Engineer will work closely with the RF Engineering team to identify, evaluate and mature manufacturing technologies that support the company’s long-term technology roadmap, ensuring future products are scalable, manufacturable and reliable.
The successful candidate will drive process robustness, yield improvement, manufacturability and cost efficiency while supporting new product introduction (NPI) and ongoing production.
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